PEEK GF30 glass fiber reinforced pellets for semiconductor etching equipment
PEEK Compounds, Polyamides (PA)

PEEK GF30 (30% Glass Fiber Reinforced)

SPECS: 30% GF | Tensile: 185 MPa | HDT: 315 C | Water Abs: 0.1 percent
FEATURES: High stiffness and chemical resistance. Ideal for semiconductor etching and vacuum chamber parts.